PUN, Chi Man 潘治文
B.Sc., M.Sc., Ph.D.


Department of Computer and Information Science
Faculty of Science and Technology
University of Macau
Avenida da Universidade, Taipa
Macau, China

Location:     E11-4091
Telephone: (853) 8822-4369
E-mail:        cmpun AT {umac.mo, um.edu.mo}


Prof. Pun received his Ph.D. degree in Computer Science and Engineering from the Chinese University of Hong Kong in 2002, and his M.Sc. and B.Sc. degrees from the University of Macau. He had served as the Head of the Department of Computer and Information Science, University of Macau from 2014 to 2019, where he is currently a Professor and in charge of the Image Processing and Pattern Recognition Laboratory. He has investigated many externally funded research projects as PI, and has authored/co-authored more than 200 refereed papers in many top-tier journals (including T-PAMI, T-IFS, T-IP, T-DSC, and T-KDE) and conferences (including AAAI, ECCV, MM, ICDE, and VR). He also has two US Patents granted and is the recipient of the Macao Science and Technology Award 2014. Dr. Pun has served as the General Chair for the 10th &11th International Conference Computer Graphics, Imaging and Visualization (CGIV2013, CGIV2014), the 13th IEEE International Conference on e-Business Engineering (ICEBE2016), and the General Co-Chair for the IEEE International Conference on Visual Communications and Image Processing (VCIP2020) and the International Workshop on Advanced Image Technology (IWAIT2022), and the Program/Local Chair for several other international conferences. He has also served as the SPC/PC member for many top CS conferences such as AAAI, CVPR, ICCV, ECCV, etc. His research interests include Image Processing and Pattern Recognition; Multimedia Information Security, Forensic and Privacy; Adversarial Machine Learning and AI Security, etc. He is also a senior member of the IEEE.

On-going research projects and selected publications can be found Here.

More publications can be found in his Google Scholar and ORCID webpages.

* PhD/PostDoc/RA positions are available for application.